加强型焊柱CU-CCGA

  • 2019-05-25
  • 1
  • 来源:加强型焊柱CU-CCGA       发布时间:2017.05.02

    新产品简介-加强型焊柱Cu-CCGA
     
        加强型锡柱是在普通锡柱的基础上演变而来。通过在普通焊线上绕一定规格的铜线,然后在进行电镀Sn63/Pb37合金形成良好的外观。加强型焊柱具有比普通焊锡柱更好的热循环性能,同时在CCGA欧宝app时,Sn20/Pb80(固相点183℃,液相点280℃)合金具有更好的回流焊窗口。
          Copper wrap solder columns based on the plain solder columns are an advnced development.we will wind a certain size copper wires or copper foils around the core solder wire, then The hot solder coating(Sn63/Pb37 eutectic alloy) is appendedCompared with traditional plain solder columns,copper wrap solder columns have better thermal cycling ability, and Sn20/Pb80 alloy (The solidus temperature, 183℃, the liquidus temperature, 280℃) makes it more suitable for reflow soldering window.
     
     
     
    剖面图  Cross-section
     
    对 比  Comparison
     
     
     
    亮 点  Lightspot
     
    规格与型号 Specifications