微弹簧圈MCS

  • 2019-05-24
  • 34
  • 来源:微弹簧圈MCS       发布时间:2017.05.02

    新产品简介-微弹簧圈MCS

     
     
    背 景 Background
          微螺旋弹簧(Micro-coil Spring,MCS)欧宝app技术因应复杂、恶劣使用环境运而生。弹簧结构不仅继承了CCGA的优异表现,更能够承受更大的应力,以确保连接机构的稳定性,从而获得更长的使用寿命,未来将在航天航空、军事上发挥重要的作用。
           Micro-coil Spring (MCS) package emerges at the right moment for temperature extremes, thermal cycling and vibration. Helical spring structure not only inherit the performance advantages of other CCGA, but also bear great stress so as to ensure the integrity of the solder connection and function, and greatly extend the service life of components. Micro-coil Spring will play an impaortant rule in aerospace and military filed.
     
     
     
     
    构 造 图 Structure
     
      微弹簧圈由本体螺旋弹簧和钎料镀层组成,其两端分别存在一个相邻的闭合线圈。它的本体螺旋弹簧部分是由铍铜合金制成。
          Micro-coil  spring is consist of helical spring and solder coating.Ontology helical spring is made of beryllium copper alloy.
     
     
     
     
    有限元模拟 Finite Element Simulation
     
    MCS出现失效的部分在螺旋弹簧线圈上。
    Failure is likely to occur in the coil windings rather than at the solder fillet.
    失效模式 Failure Modes
     
    MCS欧宝app的失效形式主要有两种,如图所示。
    MCS package has two main failure modes, as are shown.
    规格与型号 Specifications